Assessing PCB Assembly process – Solder Paste or Glue, Single side or Double side, RoHS or Sn / Pb and other attributes
Design & Development Process :
Design approach – Stencil Frame Size Required like 23”X23” / 29”X29”, 650 x 550 mm
Stencil thickness for Paste process / Glue process – whether step stencil required
Squeeze Print direction
PCB orientation, Alignment for Top and / or Bottom side
Fiducials requirements – Half etched, full etched, no. of fiducials, locations map w.r.t Bare PCB.
Aperture reduction and shape changes, best suitable for required process and SMT Infra
DFM Study, Aspect Ratio, Area Ratio
Stencil finish to ensure smooth paste / glue release during printing
Other criticalities based on process and customer needs
Output :
Checkplot with all dimensions, fiducials, apertures and technicalities
DFM sheet with Aspect ratio, Area ratios
Physical Stencil fabrication based on final check plot approval, technical specs and best suitability as per Bare PCB and process requirements
Jigs / Fixture Hardware Design & Software development
We provide Turnkey solutions in terms of both Hardware & Software to meet the Test specification for PCBA functional testing as per customer requirement
Input Data Required :
CAD/ Gerber Data.
Bill of materials with IC part numbers.
Schematics
Functional test Specifications with Test points details
Assembled Golden Sample PCBA
PCBA Overview
PCBA Connection details.
Special Hardware/ software requirement.
Hardware Design Capabilities :
Mechanical & Pneumatic fixtures
Side Access options
Fixtures for Flash/ISP Programming
Probe selection as per the current requirement and board design constraints.